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SIT – Selective OSP and ENIG
Metal backed multilayer board. Alumium plated bonded with non- flow prepreg. We can also offer other advanced metal core solutions
axis routing and plated board
Mixed dielectric build-up. Arlon thermoset material laminated together with FR-4 forming a 3- layer high frequency board.
$0.00
Mixed dielectric build-up.
Metal backed multilayer board.
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